Technical Capability
Feature | Capability |
---|---|
Quality Grade | Standard IPC 1 |
Number of Layers | 1 - 4 Layers |
Order Quantity | 5 Pcs - 500 Pcs |
Build Time | 2 - 7 Days |
Material | FR-4 Standard Tg 400 |
Board Size | Min 5*5mm | Max 500*500mm |
Board size tolerance | ±0.1mm - ±0.3mm |
Board Thickness | 0.4mm - 2.0mm |
Board Thickness Tolerance | ±0.1mm - ±10% of thickness of board |
Copper Weight | 1.0oz - 2.0oz |
Inner Layer Copper Weight | 0.5oz - 1.0oz |
Copper Thickness Tolerance | +0μm +20μm |
Min Tracing/Spacing | 5mil/6mil (copper weight: 1oz) 8mil/8mil (copper weight: 2oz) |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Black |
Surface Finish | Lead Free HASL - RoHS
HASL - Hot Air Solder Leveling ENIG - Electroless Nickle/Immersion Gold - RoHS |
Min Annular Ring | 5mil |
Min Drilling Hole Diameter | 8mil |
Min Width of Cutout (NPTH) | 0.8mm |
NPTH Hole Size Tolerance | ±.002" (±0.05mm) |
Min Width of Slot Hole (PTH) | 0.6mm |
PTH Hole Size Tolerance | ±.003" (±0.08mm) - ±.006" (±0.15mm) |
Surface/Hole Plating Thickness | 20μm - 30μm |
SM Tolerance (LPI) | .003" (0.075mm) |
Aspect Ratio | 10:1 (board thickness: hole size) |
Test | 10V - 250V, flying probe or testing fixture |
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